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MessagePosté le: Dim 16 Oct - 02:45 (2016)    Sujet du message: Tsmc 3d Ic Pdf Download Répondre en citant

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2009 Synopsys Insight, Issue 4 - 2009 More 3D-IC FAQs3D-IC INITIATIVE LAUNCHGalaxy PlatformSNUG 2016 Synopsys, Inc. Synopsys Sentaurus Interconnect TCAD tool is used to analyze these effects and to model the TSVs in the die stacks, enabling performance and reliability optimization. 3D-IC VIDEOMichael Jackson introduces Synopsys 3D-IC initiative 3D-IC TEST WHITEPAPERTest Automation of 3D Integrated Systems New 3D-IC Initiative Synopsys unveils 3D-IC initiative to accelerate design of stacked multi-die silicon systems using 3D-IC integration News Synopsys Collaborates with A*STAR IME to Optimize TSI Technology Synopsys and TSMC Deliver 3D-IC Design Support Synopsys Unveils 3D-IC Initiative Imec and Synopsys Collaborate on 3D Stacked IC Development More All Synopsys News Articles A Silicon Interposer-based 2.5D-IC Design Flow, Going 3D by Evolution Rather than by Revolution The Fast Track to 3D-IC Testing Synopsys Debuts DesignWare STAR ECC IP More White Papers Test Automation of 3D Integrated Systems More Webinars Moore's Cores - Optimizing Processor Cores For Your SoC More Videos Synopsys Unveils 3D-IC Initiative Introduction to New 2011.09 Test Automation Features Antun Domic Introduces StarRC Custom More Newsletters Synopsys Insight, Issue 1 - 2012 TCAD Newsletter, Sept. DOWNLOAD DATASHEET CustomSim Combines the best-in-class engines of HSIM, NanoSim & XA into a single unified circuit simulation solutionDOWNLOAD DATASHEET Key Benefits Synopsys is delivering a comprehensive EDA solution, including enhanced versions of its IC implementation and circuit simulation products, to support 3D-IC design 3D-IC integration technologies offer tangible benefits to boost system performance, reduce form factor and lower power consumption Complements conventional transistor scaling to enable higher levels of integration by allowing multiple die to be stacked vertically, or in a side-by-side 2.5D configuration on a silicon interposer An innovative way to deliver large-scale devices with favorable yield and reliability Design ChallengesCompared with traditional monolithic ICs, the 3D-IC integration approach of stacking multiple die using through-silicon via (TSV) and silicon interposer technologies is an innovative way to deliver large-scale devices with favorable yield and reliability. Furthermore, TSVs, microbumps and other solder bumps produce a permanent stress in the zone around them. 3D-IC integration uses through-silicon via (TSV) technology, an emerging interconnection technology that will replace the traditional wire-bonding process in chip/wafer stacking, to increase inter-die communication bandwidth, reduce form factor and lower power consumption of stacked multi-die systems. Semiconductor companies, such as foundries, use the modeling results to create design rules specific to 3D-IC integration to ensure manufacturability and reliability. All Rights Reserved.

2011 TCAD Newsletter, Sept. Tools Benefits Challenges Interconnect Simulation Tools for electrical, stress and reliability analysis of interconnects Sentaurus InterconnectPerforms 3D interconnect stress and reliability simulation using design database and process recipesTest Automation Industry's most comprehensive test solutions DFTMAXAdaptive scan compression for cost-effective DSM testing DOWNLOAD DATASHEET (PDF)Memory Test and Repair IP STAR (self-test and repair) Memory System solutions DesignWare STAR Memory System Comprehensive, integrated test, repair and diagnostics solutionDOWNLOAD DATASHEET (PDF) Physical Implementation Comprehensive Place and Route System IC Compiler IINetlist to GDSII implementation system enabling 10X faster throughput and higher QoR DOWNLOAD DATASHEET (PDF) IC CompilerPlace and route for established and emerging processes DOWNLOAD DATASHEET (PDF) Custom Implementation Modern-era custom implementation Custom Designer SECustom Schematic Editor DOWNLOAD DATASHEET (PDF) Custom Designer LE Custom Layout editor DOWNLOAD DATASHEET (PDF)Custom Designer SDL Custom design schematic-driven layoutDOWNLOAD DATASHEET (PDF) Physical Verification Comprehensive physical verification IC ValidatorIn-design physical verification solution for 45nm and below DOWNLOAD DATASHEET (PDF) Signoff Golden, comprehensive signoff solutions PrimeRailIn-Design Rail Analysis for Place-and-Route Engineers DOWNLOAD DATASHEET (PDF) StarRC UltraIndustry leading parasitic extraction for digital and custom designDOWNLOAD DATASHEET (PDF)Circuit Simulation Performance, accuracy and capacity for AMS verification HSPICEThe industry's "gold standard" for accuracy, offers foundry-certified device models with state-of-the-art simulation and analysis algorithms. Any temperature change causes material stress due to thermal mismatch, leading to silicon deformation and affecting transistor performance. Contact usLocations PrivacyLegal .. 3D-IC technology complements conventional transistor scaling to enable designers to achieve higher levels of integration by allowing multiple die to be stacked vertically, or in a side-by-side "2.5D" configuration on a silicon interposer. Multi-die stacks incorporate different materials, often bonded together, with varying coefficients of thermal expansion (CTE). Synopsys 3D-IC initiative begins at the semiconductor device level.

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